Polyimide and polyamide-imide precursors prepared from esters, d

Details Polyimide and polyamide-imide precursors prepared from esters, d Polyimide and polyamide-imide precursors prepared from esters, d

1974-10-22

1976-04-20

Welsh, M. J.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

252182, 427385, 427388, 428458, 428474, C08G 1800

Patent

active

039520846

ABSTRACT:
A solution is prepared of about 30 to about 60 mole percent of a mono-ester of a tricarboxylic anhydride or a diester of a tetracarboxylic acid and about 40 to about 70 mole percent of a dianhydride. An aromatic diisocyanate is added and the solution heated until the viscosity no longer increases. The precursor can be precipitated by the addition of a non-solvent, collected, and re-dissolved in a solvent. The solution of the precursor can be applied to a sheet and cured to form a polyimide or polyamide-imide film, or it can be applied to a wire and cured to form a polyimide or polyamide-imide wire enamel.

REFERENCES:
patent: 3300420 (1967-01-01), Frey
patent: 3489696 (1970-01-01), Miller
patent: 3493540 (1970-02-01), Muller et al.
patent: 3505295 (1970-04-01), Grunsteidl et al.
patent: 3551383 (1970-12-01), Fang
patent: 3625911 (1971-12-01), Redman et al.
patent: 3708458 (1973-01-01), Alberino et al.
patent: 3853813 (1974-12-01), Edelman et al.
Meyers, J. of Polymer Sci., Part 1-A, Vol. 7, 1969, pp. 2757-2762.
Carleton et al., J. Applied Poly. Sci., Vol. 16, 1972, pp. 2983-2989.
Derwent Jap. Pat. Rept., 1967, 6, No. 2. Gp. 1, 12-3, (Abstract Jap. Pat. 676-7/67).

Affiliated with

Also associated with

Rating

Polyimide and polyamide-imide precursors prepared from esters, d does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyimide and polyamide-imide precursors prepared from esters, d, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide and polyamide-imide precursors prepared from esters, d will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1588190