Chemistry: electrical and wave energy – Processes and products
Patent
1985-04-01
1986-03-04
Terapane, John
Chemistry: electrical and wave energy
Processes and products
204234, 204235, 204DIG13, C25D 338, C25B 1500
Patent
active
H00000361
ABSTRACT:
The invention comprises improvements in inert anode electroplating processes that make possible the utilization of typically inexpensive and otherwise advantageous cation-yielding compounds for replenishing the plating bath, compounds that typically are not well suited for such use in prior art systems due to their relatively low dissolution rate which typically requires their use in powder form, and the tendency of the powder particles to aggregate. Exemplary applications for the improved plating process are in Cu-, Ni-, and Pd-plating, and exemplary cation-yielding compounds or CuO, NiO, PdO, Cu(OH).sub.2,Ni(OH).sub.2, and Pd(OH).sub.2. The improvements according to the invention comprise agitating the powder/electrolyte mixture or slurry in a reactor vessel separate from the plating tank, and maintaining the cation concentration in the plating tank within predetermined limits. Agitation typically requires power input to the slurry of at least about 2.5 watt/liter of slurry, with a preferred range of power for CuO of about 10 .mu.m average particle size and concentration between about 5 and about 200 gram/liter being between about 5 and about 200 watt/liter of slurry. Schemes for maintaining the cation concentration in the plating bath within predetermined limits are described, and include controlling the rate of addition of cation-yielding compound to the slurry, and/or controlling the flow rate of electrolyte between reactor and plating tank.
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AT&T Bell Laboratories
Locker Howard J.
Pacher Eugen E.
Terapane John
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