Method for manufacturing printed circuit boards

Details Method for manufacturing printed circuit boards Method for manufacturing printed circuit boards

1988-08-25

1989-10-24

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29851, 29852, H05K 336

Patent

active

048752835

ABSTRACT:
There is disclosed a dual purpose separator-release plate (30) for the use in the lamination and drilling of printed circuit boards, comprising a substrate sheet of aluminum foil (32), covered on both sides with release material (34), the plates being placed in engagement with the foil surfaces (6) and (8) of a PC board prior to curing the epoxy layer (4), after curing, retaining the separator-release plates in engagement with the PC board, and which plates serve as drill entry and drill backup material.

REFERENCES:
patent: 3969177 (1976-07-01), Doran et al.

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