Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1980-12-17
1983-01-04
Ozaki, G.
Metal working
Method of mechanical manufacture
Assembling or joining
29576B, 29577C, 148187, H01L 2126
Patent
active
043666132
ABSTRACT:
A method of manufacturing LDD MOS FET RAM capable of delineating short (less than 1 micrometer) lightly doped drain regions. An N.sup.- implant is effected between gate electrodes and field oxide insulators, before the N.sup.+ implant. An insulator layer is then deposited also prior to N.sup.+ ion implantation. Reactive ion etching of the layer leaves narrow dimensioned insulator regions adjacent the gate electrode which serves to protect portions of the N.sup.- impurity region during the subsequent N.sup.+ implant. These protected regions are the lightly doped source/drain regions.
REFERENCES:
patent: 3996657 (1976-12-01), Simko et al.
patent: 3997367 (1976-12-01), Yau
patent: 4038107 (1977-04-01), Marr et al.
patent: 4160683 (1979-07-01), Roche
patent: 4182636 (1980-01-01), Dennard et al.
patent: 4198250 (1980-04-01), Jecmen
patent: 4209349 (1980-06-01), Ho et al.
patent: 4209350 (1980-06-01), Ho et al.
patent: 4280271 (1981-07-01), Lou et al.
patent: 4282646 (1981-08-01), Fortino et al.
patent: 4282648 (1981-08-01), Yu et al.
patent: 4287661 (1981-09-01), Stoffel
patent: 4290186 (1981-09-01), Klein et al.
Bassous, E. et al; "Self-Aligned Polysilicon Gate Mosfets with Tailored Source and Drain Profiles", IBM Technical Disclosure Bulletin, vol. 22, No. 11, Apr. 1980, pp. 5146-5147.
Ogura Seiki
Tsang Paul J.
IBM Corporation
Ozaki G.
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