Patent
1984-08-03
1986-05-06
Edlow, Martin H.
357 76, 357 77, 357 80, 357 81, H01L 2336, H01L 2310
Patent
active
045875502
ABSTRACT:
A press-packed semiconductor device in which means for positioning and fixing a semiconductor element with respect to an electrode disk member is improved. In a press-packed semiconductor device, a semiconductor element is press-held between a pair of electrode disk members via heat buffer plates. According to this invention, a fixing member made of electrical insulating material is provided on the peripheral portions of at least one of main surfaces of a semiconductor substrate of the semiconductor element. The inner periphery of the fixing member is formed so as to substantially contact the outer periphery of at least one of the heat buffer plate. This contact provides a reliable and easy positioning and lateral fixing of the semiconductor element against the heat buffer plate. Accordingly, to braze the electrode to the heat buffer plate of the semiconductor device becomes unnecessary.
REFERENCES:
patent: 2712619 (1955-07-01), Zetwo
patent: 3328650 (1967-01-01), Boyer
patent: 3489957 (1970-01-01), De Warga
patent: 3654529 (1972-04-01), Lord
patent: 3800192 (1974-03-01), Eisele et al.
patent: 4129243 (1978-12-01), Cusano et al.
patent: 4246596 (1981-01-01), Iwasaki
patent: 4374393 (1983-02-01), Kamahara
Edlow Martin H.
Jackson Jerome
Tokyo Shibaura Denki Kabushiki Kaisha
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