Lead frame with fusible links

Details Lead frame with fusible links Lead frame with fusible links

1983-01-20

1986-05-06

James, Andrew J.

357 68, 357 80, H01L 2312, H01L 2348

Patent

active

045875480

ABSTRACT:
Copper lead frame for manufacturing a semiconductor chip carrier has signal leads extending from outer leads about the periphery of the frame and temporarily attached to a ground bus toward the center of the frame by fusible links. Ground leads extend from bus alternately with signal leads and have fusible links at outer leads which are melted to isolate them from signal leads and eliminate noise between signal leads in finished carrier. A power bus located within the ground bus and a chip mounting pad located with the power bus are similarly positioned by fusible links.

REFERENCES:
patent: 3548494 (1970-12-01), Haring
patent: 3564354 (1971-02-01), Aoki et al.
patent: 3691290 (1972-09-01), Napier
patent: 4023053 (1977-05-01), Shimizu et al.
patent: 4032949 (1977-06-01), Bierig
patent: 4234666 (1980-11-01), Gursky
patent: 4362902 (1982-12-01), Grabbe
patent: 4380042 (1983-04-01), Angelucci, Sr. et al.
patent: 4408218 (1983-10-01), Grabbe

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