Method for metallizing ceramic green sheets

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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29424, 29625, 156155, 264 61, 264104, 427 97, 427272, 427226, 427282, 427259, 427287, C04B 3900

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039487067

ABSTRACT:
A process for metallizing a ceramic green sheet having via holes or recessed grooves formed therein by depositing a mask forming material over the green sheet, the mask forming material being non-wettable by a composition, either conductive or nonconductive, to be subsequently deposited in the via holes or recessed grooves. After the depositing step, a metal paste is spread or wiped into the vias and grooves and then the sheets are laminated and fired to form a multi-layer ceramic interconnection package whereby the mask forming material is volatized and eliminated from the structure without the necessity of removing the mask forming material in the conventional etching or peeling away methods.

REFERENCES:
patent: 2139640 (1938-12-01), Mall et al.
patent: 2993815 (1961-07-01), Treptow
patent: 3293072 (1966-12-01), Doolittle et al.
patent: 3502491 (1970-03-01), Orth
patent: 3518756 (1970-07-01), Bennett et al.
patent: 3615980 (1971-10-01), Schuck et al.
patent: 3632365 (1972-01-01), Gray
patent: 3770529 (1973-11-01), Anderson
Chance et al., "Obtaining Thick Metal Planes in Sintered Ceramics," (IBM Tech. Pub.), Vol. 10, No. 11, 4-1968.

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