Process for forming passivation film on photoelectric conversion

Stock material or miscellaneous articles – Composite – Of silicon containing

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427 39, 427 74, 428450, 428457, B32B 904

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045871710

ABSTRACT:
In a process for forming a passivation film on the surface of a photoelectric conversion device having a junction between hydrogenated amorphous silicon and a conductive electrode, the passivation film is formed by the steps of forming a first passivation film of silicon oxide on the surface of the photoelectric conversion device and then forming a second passivation film of silicon nitride on the first passivation film. In this process, the first passivation film is formed under an atmosphere of a mixed gas prepared by mixing an excess of a gas containing oxygen with silane gas in accordance with the plasma CVD method.

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patent: 4091169 (1978-05-01), Bohg et al.
patent: 4344985 (1982-08-01), Goodman et al.
patent: 4379943 (1983-04-01), Yang et al.
patent: 4410558 (1983-10-01), Izu et al.

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