Pressure-contact sealing arrangement for a semiconductor pellet

Details Pressure-contact sealing arrangement for a semiconductor pellet Pressure-contact sealing arrangement for a semiconductor pellet

1983-03-04

1986-05-27

Davie, James W.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 81, 357 76, 357 75, 361388, 174 52P, H01L 2342, H01L 2344, H01L 2346

Patent

active

045918961

ABSTRACT:
An assembled semiconductor device comprising a base constituting one electrode, a semiconductor pellet mounted on the base, an insulation ring located to surround the semiconductor pellet and having a height larger than the thickness of the semiconductor pellet, an electrode member mounted on the insulation ring and in electrical contact with the upper surface of the semiconductor pellet, a lead electrode disposed on the electrode member, a pressure plate mounted on the lead electrode through an insulation member or being formed of an insulation material and disposed on the lead electrode, a bolt screwed into the base, and a pressing device which presses the semiconductor pellet through the pressure plate. The inventive device simplifies the assembling process, makes the maintenance easy, and improves the air-tightness for the semiconductor pellet.

REFERENCES:
patent: 3651383 (1972-03-01), Livezey et al.
patent: 3686540 (1972-08-01), Furnival
patent: 3753053 (1973-08-01), Swartz
patent: 3886586 (1975-05-01), Bahlinger et al.
patent: 4218695 (1980-08-01), Egerbacher et al.
patent: 4224663 (1980-09-01), Maiese et al.
patent: 4399452 (1983-08-01), Nakashima et al.
patent: 4499485 (1985-02-01), Schierz et al.

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