Method for manufacturing semiconductor device

Details Method for manufacturing semiconductor device Method for manufacturing semiconductor device

1989-03-08

1990-09-18

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437927, 26427217, H01L 2315, H01L 31203

Patent

active

049578820

ABSTRACT:
Disclosed is a method for manufacturing a semiconductor device having a semiconductor chip with a light receiving element disposed in a surface of the semiconductor chip, and a light transmission window having a first surface facing the light receiving element and a second surface generally parallel to the first surface and for protecting the light receiving element. One of two liquid agents constituting a two-part adhesive is applied to the surface of the semiconductor chip so that the liquid agent surrounds the light receiving element, and the other of the liquid agents of the two-part adhesive is applied to the first surface of the light transmission window in correspondence with the former liquid agent. These liquid agents are brought into contact with each other to fix the light transmission window to the semiconductor chip. The semiconductor chip and part of the light transmission window is then resin-molded so that the second surface of the light transmission window is exposed.

REFERENCES:
Kondoh et al., "The Development of the Molded Cavity Package with Optical Window", 37th Electronic Components Conference, Jul. 25, 1987.

Affiliated with

Also associated with

Rating

Method for manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1572521