Optical device assembly having a metallic bump bonding together

Details Optical device assembly having a metallic bump bonding together Optical device assembly having a metallic bump bonding together

1994-12-22

1997-11-18

Le, Que

Radiant energy

Photocells; circuits and apparatus

Optical or pre-photocell system

257433, 359 66, G01J 350

Patent

active

056891067

ABSTRACT:
An optical device assembly includes a planar optical filter and a planar sensor having an optically active area. The optical filter and the sensor are joined together with a gap therebetween by a metallic bump extending between the optical filter and the sensor. The metallic bump, which is preferably indium, is positioned at a location outside of the optically active area of the planar sensor. The metallic bump is preferably formed by vapor depositing an indium subbump on the optical filter and another indium subbump on the planar sensor, in each case outside of their optically active areas, and thereafter pressing the two subbumps together to complete the bonding.

REFERENCES:
patent: 4636631 (1987-01-01), Carpentier et al.
patent: 4695719 (1987-09-01), Wilwerding
patent: 5289002 (1994-02-01), Tarn
patent: 5336547 (1994-08-01), Kawakita et al.
patent: 5380669 (1995-01-01), Norton
patent: 5436492 (1995-07-01), Yamanaka
patent: 5506401 (1996-04-01), Segawa et al.

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