Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1983-04-21
1986-05-06
Saba, William G.
Metal working
Method of mechanical manufacture
Assembling or joining
29576B, 29577C, 29578, 148187, 148DIG70, 148DIG117, 148DIG141, 156653, 156657, 357 231, 357 239, 357 2311, 357 41, 357 42, H01L 2126, H01L 2131
Patent
active
045862389
ABSTRACT:
The present invention deals with a semiconductor memory circuit device, in which a memory array portion of a rectangular shape consisting of semiconductor non-volatile memory elements is formed on a main surface of the semiconductor substrate, a low voltage driver circuit (decoder) is formed along a side of the memory array portion, and a high voltage driver circuit is formed along an opposite side of the memory array portion. This permits a reduction in word line length and avoids crossing of the word lines to permit increased operation speed and, particularly, increased reading speed.
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Hagiwara Takaaki
Itoh Yokichi
Kondo Ryuji
Minami Shin-ichi
Yatsuda Yuji
Hitachi , Ltd.
Saba William G.
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