Semiconductor chip, package and semiconductor device

Details Semiconductor chip, package and semiconductor device Semiconductor chip, package and semiconductor device

1996-09-20

1998-04-07

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257781, H01L 2348, H01L 2352, H01L 2940

Patent

active

057367906

ABSTRACT:
Disclosed is a bump formed on a pad which is provided on either a semiconductor chip or a package or a wiring substrate for input or output thereof, for making electric connection on the pad. The bump has: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material. With another conductive bonding material provided on the other pad of a wiring substrate or a package, the ball of the bump of the semiconductor chip or the package is placed close to another pad of the wiring substrate or package. The conductive bonding material of the other pad is heated and melted to connect the ball and the other pad of the wiring substrate or package by the conductive bonding material.

REFERENCES:
patent: 5550408 (1996-08-01), Kunitomo et al.
patent: 5600180 (1997-02-01), Kusaka et al.
patent: 5640052 (1997-06-01), Tsukamoto

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