Construction that prevents the undercut of interconnect lines in

Details Construction that prevents the undercut of interconnect lines in Construction that prevents the undercut of interconnect lines in

1995-11-30

1997-11-18

Niebling, John

Fishing, trapping, and vermin destroying

437192, 437194, 437228, 1566561, H01L 2128

Patent

active

056887175

ABSTRACT:
A Ti.sub.x N.sub.y layer, not necessarily stoichiometric, is interposed between a titanium or aluminum interconnect layer to improve adhesion and prevent re-entrant undercutting and lifting of the interconnect layer during the process of patterning and plasma etching to form interconnect lines on a substrate, such as an oxide.

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S. Wolf, "Silicon Processing for the VLSI Era, vol. 2", Lattice Press, pp. 194-199, Jun. 1990.
S. Wolf, "Silicon Processing for the VLSI Euo, vol. I", Lottice Press 1986, p. 407.

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