Method and apparatus for assembling semiconductor devices such a

Details Method and apparatus for assembling semiconductor devices such a Method and apparatus for assembling semiconductor devices such a

1984-08-22

1986-05-27

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29588, 29583, 29576S, 29569L, 148DIG28, H01L 2156, H01L 2160

Patent

active

045906670

ABSTRACT:
A wafer divided into rows of abutted end-to-end dice (i.e., semiconductor chips) is placed on a thin, non-elastic membrane and drawn tightly over a knife-edge to successively separate each row of dice from the membrane. The dice are then attached to individual leadframes directly or are picked up by a vacuum fixture and carried to a position where they are secured to the leadframes and are wire bonded. After bonding, the components are assembled into finished subassemblies. In one embodiment, LED lamps are fabricated. A reflector is secured to each leadframe over the die positioned thereon, and the leadframe, die and reflector are molded into a lamp subassembly, which is used to form a larger lamp or display fixture.

REFERENCES:
patent: 3490141 (1970-01-01), Lesk
patent: 3497948 (1970-03-01), Wiesler et al.
patent: 3568307 (1971-03-01), Zanger et al.

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