Fishing – trapping – and vermin destroying
Patent
1994-11-22
1996-01-30
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437 8, 437180, 437183, 437192, H01L 2100
Patent
active
054879990
ABSTRACT:
A method for forming contacts for establishing an electrical connection with contact locations on a semiconductor die is provided. The contacts are formed as raised members mounted on a compliant substrate. Each contact includes a rough textured surface having asperities adapted to penetrate the contact location on the die to a limited penetration depth. The height of the asperities is between about 1000.ANG. to 10,000.ANG.. The textured surface and asperities are formed by electroplating a rough metal layer on a raised metal contact or by etching a surface of a raised metal contact. In an illustrative embodiment the contacts comprise microbumps formed on a compliant polyimide substrate. For forming an interconnect suitable for establishing a temporary electrical connection with an unpackaged semiconductor die, the polyimide substrate is attached to a rigid substrate, such as silicon, having a coefficient of thermal expansion that matches that of a silicon die. The interconnect can then be used with a carrier for testing the unpackaged die.
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Gratton Stephen A.
Hearn Brian E.
Micro)n Technology, Inc.
Picardat Kevin M.
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