Method of making an electronic package structure utilizing alumi

Details Method of making an electronic package structure utilizing alumi Method of making an electronic package structure utilizing alumi

1994-12-21

1997-11-18

Simmons, David A.

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 60, 156 89, 75230, 257703, C04B 3332, B32B 3104

Patent

active

056884508

ABSTRACT:
A packaged electronic structure includes an electronic device, and a package to which the electronic device is affixed. At least a portion of the package is made of a composite material of aluminum nitride dispersed in aluminum. The composite material is preferably prepared by mixing powders of the aluminum nitride and aluminum, and thereafter pressing and sintering the mixture.

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