Composite transversely plastic interconnect for microchip carrie

Details Composite transversely plastic interconnect for microchip carrie Composite transversely plastic interconnect for microchip carrie

1994-03-07

1995-04-25

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228246, 228253, H01L 2144, H01L 2158

Patent

active

054091578

ABSTRACT:
A composite transversely plastic interconnect for a microcarrier produces a carrier-to-substrate bond having low electrical resistance and high mechanical strength, significant bond height to mediate TCE mismatch between dissimilar carrier and substrate materials, and sufficient gap between the carrier and the substrate to permit effective post solder cleaning of the interconnect. A contact array consisting of solder balls is placed directly onto either of a carrier or a substrate interconnect surface with a stencil positioned to the chosen interconnect surface. The solder balls may have a selected melting temperature. Additionally, the solder balls may have a metallic coating, such as nickel or copper, or molten solder. The carrier and substrate are joined by mating an interconnect surface of each and applying heat. Solder paste may be applied to one of the interconnect surfaces to add additional height to the joint and compensate for lack of coplanarity between the carrier and the substrate.

REFERENCES:
patent: 4771159 (1988-09-01), O'Leary
patent: 5060844 (1991-10-01), Behun et al.
patent: 5093986 (1992-03-01), Mandai et al.
patent: 5118027 (1992-06-01), Braun et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5251806 (1993-10-01), Agarwala et al.

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