Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent
1993-04-23
1995-04-25
Ramsey, Kenneth J.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
228232, 2282341, 228262, B23K 106, B23K 1008, H05K 334
Patent
active
054091551
ABSTRACT:
A method and apparatus for soldering areas of two parts together such as solder leads of an electronic component to the solder pads on a printed circuit board which includes the step of raising the temperature of the abutting areas to a value greater than the melting temperature of the solder and while at the elevated temperature, vibrating the parts to align (center) the areas with respect to one another. Accordingly a reflow oven designed to practice this invention includes a conveyor system with three continuous belts leading in series from the entrance to the exit of the oven. The first belt carries the parts through a temperature zone where melting of the binder occurs; the second belt carries the parts through a hotter zone where melting of the solder and vibration to effect centering occurs; the third belt carries the part through the cooling zone. Separation of the belt into three isolated sections prevents disturbance of the parts when they are located in areas where the solder is not molten.
REFERENCES:
patent: Re33197 (1990-04-01), Deambrosio
patent: 3005257 (1961-10-01), Fox
patent: 3716907 (1973-02-01), Anderson
patent: 3791028 (1974-02-01), Missel
patent: 3882596 (1975-05-01), Kendziora et al.
patent: 4529115 (1985-07-01), Renshaw et al.
patent: 4619715 (1986-10-01), Hwang
patent: 4684056 (1987-08-01), Deambrosio
patent: 4696226 (1987-09-01), Witmer
patent: 4730764 (1988-03-01), Hawkins et al.
patent: 4831724 (1989-05-01), Elliott
patent: 5028399 (1991-07-01), Suppelsa et al.
patent: 5076487 (1991-12-01), Bandyopadhyay
patent: 5085364 (1992-02-01), Ishikawa
patent: 5121874 (1992-06-01), Deambrosio
patent: 5145531 (1992-09-01), Turner et al.
patent: 5259546 (1993-11-01), Volk
Graham, "Surface Mount Technology" Sep. 1990 pp. 51-54.
Graham, "Achieving Perfect SMT Component Location After Reflow" Surface Mount Technology (1990) 51-54.
Ramsey Kenneth J.
Solectron Croporation
LandOfFree
Vibrational self aligning parts in a solder reflow process does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Vibrational self aligning parts in a solder reflow process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vibrational self aligning parts in a solder reflow process will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1562957