Electrically conductive resinous bond and method of manufacture

Details Electrically conductive resinous bond and method of manufacture Electrically conductive resinous bond and method of manufacture

1985-03-29

1987-05-19

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29 2535, 156276, 156305, 156315, 1563311, 310321, 310348, 4284735, B32B 3100

Patent

active

046665471

ABSTRACT:
A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40.degree. to 365.degree. C. to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.

REFERENCES:
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 4263702 (1981-04-01), Vig et al.
patent: 4266157 (1981-05-01), Peters

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