Opto-coupler semiconductor device

Details Opto-coupler semiconductor device Opto-coupler semiconductor device

1976-12-27

1978-08-22

Miller, Jr., Stanley D.

357 68, 357 69, H01L 3112

Patent

active

041092694

ABSTRACT:
An opto-coupler semiconductor device includes a sensor integrated circuit mounted on a lead frame with an LED which is attached to beam leads on a copper clad tape mounted directly over the sensor portion of the integrated circuit by means of a transparent adhesive tape disposed directly between the LED and the integrated circuit sensor. The method of assembly is carried out by mounting the sensor integrated circuit upon the lead frame by suitable means such as a eutectic bond, attaching a tape lead or conductor by thermo-compression welding to the LED and thereafter mounting the LED by means of a double adhesive tape directly over the center portion of the integrated circuit. The assembly may then be encased in the usual manner in a body of plastic or the like.

REFERENCES:
patent: 3436548 (1969-04-01), Biard et al.
patent: 3780352 (1973-12-01), Redwanz
patent: 3925801 (1975-12-01), Haitz et al.
patent: 4001859 (1977-01-01), Miyoshi et al.

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