Method and apparatus for designing a module

Details Method and apparatus for designing a module Method and apparatus for designing a module

1995-12-05

1997-10-14

Teska, Kevin J.

Boots, shoes, and leggings

364491, G06F 1950

Patent

active

056778473

ABSTRACT:
A method for designing a multilayer module for a semiconductor package and for determining connections within a multilayer module having input-output (IO) contacts in a first array defined by first array information. A chip within the module has C4 contacts arranged in a second array defined by second array information. The connections are intermediate pairs of the IO contacts and the C4 contacts among a plurality of layers. The method comprises the steps of storing the first and second array information in storage; identifying connection paths in a layer between the pairs according to a selection algorithm using the first and second array information; identifying crossing paths; swapping either the C4 or IO contacts of selected crossing paths; identifying paths being blocked by another connection path to identify a need for a next layer to complete the blocked connection paths; repeating the method for subsequent layers for a predetermined number of iterations or until all connection paths are defined.

REFERENCES:
patent: 4500963 (1985-02-01), Smith et al.
patent: 4777606 (1988-10-01), Fournier
patent: 4852015 (1989-07-01), Doyle et al.
patent: 4855929 (1989-08-01), Nakajima
patent: 5074037 (1991-12-01), Sutcliffe et al.
patent: 5224057 (1993-06-01), Igarashi et al.
patent: 5264664 (1993-11-01), McAllister et al.
patent: 5295082 (1994-03-01), Chang et al.
patent: 5337252 (1994-08-01), Lac et al.
patent: 5355322 (1994-10-01), Yamashita et al.
patent: 5373628 (1994-12-01), Suehiro et al.

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