Semiconductor package having reinforced lead pins

Details Semiconductor package having reinforced lead pins Semiconductor package having reinforced lead pins

1992-11-12

1997-10-14

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

257669, 257674, 257773, 257692, H01L 2348, H01L 2352, H01L 2940

Patent

active

056775717

ABSTRACT:
The present invention relates to a semiconductor package having lead pins of lead frame for outwardly extending terminals of electrodes of a semiconductor chip embedded in a mold resin. The semiconductor package according to the present invention comprises flat lead fins connected to respective sides of a bed portion of a lead frame, an insulation film for covering at least one side of each of the lead fins, and lead pins formed on a surface of the insulation film, the lead pins being disposed at a predetermined pitch.

REFERENCES:
patent: 3628105 (1971-12-01), Sakai et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4996585 (1991-02-01), Gruber et al.
patent: 5028983 (1991-07-01), Bickford et al.
patent: 5036380 (1991-07-01), Chase
patent: 5075760 (1991-12-01), Nakashima et al.
patent: 5105257 (1992-04-01), Michii
patent: 5237202 (1993-08-01), Shimizu et al.
patent: 5304844 (1994-04-01), Horiuchi et al.
patent: 5309019 (1994-05-01), Moline et al.

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