Shallow trench isolation in integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

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257499, 257620, 257622, H01L 2900

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active

056775644

ABSTRACT:
The invention concerns fabrication of oxide-filled isolation trenches in integrated circuits. The invention etches a network of trenches in the surface of a uniformly doped wafer which has experienced no substantial processing steps. Such a wafer will have little, if any, surface damage. Such a wafer will etch to the same depth everywhere, because two major factors which affect etching rate are (a) surface damage and (b) doping non-uniformity, and these factors are absent. The trenches are then filled with oxide. They define islands upon which devices (such as transistors) may now be fabricated.

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