Method for forming vias in multilayer circuits

Details Method for forming vias in multilayer circuits Method for forming vias in multilayer circuits

1991-08-01

1994-03-08

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

36447408, B23K 2608

Patent

active

052930254

ABSTRACT:
The invention is directed to a method for rapidly forming a pattern of vias in multilayer electronic circuits in which each of the via holes is formed by drilling with a controlled number of Nd:YAG laser beam pulses. Beam positioning is controlled by means of a programmed galvanometric beam positioner. The drilling sequence is optionally controlled by application of an heuristic algorithm of the symmetric Traveling Salesman Problem.

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