Wafer polishing device

Details Wafer polishing device Wafer polishing device

1996-01-23

1997-07-22

Smith, James G.

Abrading

Machine

Rotary tool

451285, B24B 500

Patent

active

056498551

ABSTRACT:
In a wafer polishing device, a resin sheet polishes a wafer with a polishing liquid fed thereto, while sliding on the wafer. Tension mechanisms apply an adequate degree of tension to the sheet in order to provide it with a desired elastic strength. Even if the wafer has a deformation or roughness ascribable to its uneven thickness, the sheet corrects some degree of deformation and then polishes the wafer, following the corrected configuration of the wafer. At this instant, the pressure acting on the wafer is even over the entire surface of the wafer. The sheet is formed of a material which is hydrophilic and resistant to fluoric acid. With this construction, the device corrects irregularities ascribable to the formation of a device from the wafer even if the wafer itself has any deformation or irregularity.

REFERENCES:
patent: 2618911 (1952-11-01), Indge
patent: 2979868 (1961-04-01), Emeis
patent: 3110988 (1963-11-01), Boettcher
patent: 3504457 (1970-04-01), Jacobsen et al.
patent: 3615955 (1971-10-01), Regh et al.
patent: 3708921 (1973-01-01), Cronkhite et al.
patent: 3897657 (1975-08-01), Smith
patent: 4165584 (1979-08-01), Scherrer
patent: 4458454 (1984-07-01), Barnett
patent: 4606151 (1986-08-01), Heynacher
patent: 5423716 (1995-06-01), Strasbaugh

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