Electronic device having high-density wiring

Details Electronic device having high-density wiring Electronic device having high-density wiring

1992-09-29

1994-03-08

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

1741281, 174262, 361792, H05K 100

Patent

active

052930050

ABSTRACT:
An electronic device having high density wiring formed in a multi-level layer structure which has a plurality of conductors distributed with high density. Each conductor is formed to have a sectional area which is determined on the basis of length thereof such that ones of the plurality of conductors having relatively longer lengths have sectional areas larger than those ones of relatively shorter lengths. Wirings in the electronic device are formed through effecting electrical connections of conductors having step-wise increasing sectional areas to thereby control the wiring resistance and signal propagation delay thereof and also preclude a malfunction or reduction in operation performance of the device.

REFERENCES:
patent: 4811082 (1989-03-01), Jacobs et al.
"High-Density Surface Mounting Technique" Triceps Corporation, Apr. 20, 1987, pp. 73, 126-128.
"CAE of Printed Board", Applied Technique Publishing Corporation, pp. 4-5, 58-59, 76.

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