Method for forming cavity structures using thermally decomposabl

Details Method for forming cavity structures using thermally decomposabl Method for forming cavity structures using thermally decomposabl

1996-06-21

1997-10-14

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 89, 156293, 156323, 264241, B32B 3120

Patent

active

056767889

ABSTRACT:
The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a thermally decomposable surface layer is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the thermally decomposable surface layer is conveniently removed in pyrolysis and binder removal segments of the sinter process without causing damage to the cavity shelves or paste pull-outs.

REFERENCES:
patent: 4636275 (1987-01-01), Norell
patent: 4680075 (1987-07-01), McNeal et al.
patent: 4704082 (1987-11-01), Buehler
patent: 4737208 (1988-04-01), Bloechle et al.
patent: 4749421 (1988-06-01), Matsui et al.
patent: 4833000 (1989-05-01), Trickett et al.
patent: 5037599 (1991-08-01), Olson
patent: 5057171 (1991-10-01), Horner et al.
patent: 5108532 (1992-04-01), Thein et al.
patent: 5254191 (1993-10-01), Mikeska et al.
patent: 5468315 (1995-11-01), Okada et al.
patent: 5478420 (1995-12-01), Gauci et al.
patent: 5538582 (1996-07-01), Natarajan et al.
G. C. Phillips, Jr., "Fixture for Fabricating Complex Substrate Design from Green Sheet Ceramics", IBM Technical Disclosure Bulletin, vol. 16, No. 11, Apr. 1974, p. 3559.

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