Thermal conduction element for semiconductor devices

Details Thermal conduction element for semiconductor devices Thermal conduction element for semiconductor devices

1981-08-10

1983-11-15

Richter, Sheldon J.

Heat exchange

Heat transmitter

174 16HS, 361386, H01L 2336

Patent

active

044150253

ABSTRACT:
A disk shaped thermal bridge element for use in a semiconductor package to conduct heat from a device to a cold plate, which disk element has a bulged shape with a first set of inwardly extending slots and a second set of outwardly extending slots emanating from the center of the disk.

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Kunkler et al., Module with Removable Heat Transfer Members, IBM Technical Disclosure Bulletin, vol. 23, No. 9, pp. 4095-4096, Feb. 1981.
Zirnis, Semiconductor Module with Improved Air Cooling, IBM TDB, vol. 20, No. 5, p. 1768, Oct. 1977.
Goodman, Intramodular Thermal Shunt, IBM TDB, vol. 21, No. 3, pp. 1141-1142, Aug. 1978.

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