Chemistry of carbon compounds – Miscellaneous organic carbon compounds
Patent
1976-10-26
1977-12-06
Anderson, Harold D.
Chemistry of carbon compounds
Miscellaneous organic carbon compounds
260 47CZ, 260 47CB, 260 63N, 260 65, C08G 1822
Patent
active
040616223
ABSTRACT:
The use of certain catalysts provide for an improved process for the preparation of soluble polyimides, polyamides, and polyamideimides. The catalysts are alkali metal salts of formula MOR, wherein R represents alkyl or aryl and M represents an akali metal. The improved process comprises reacting organic diisocyanates with polycarboxylic compounds consisting of tetracarboxylic acids or the intramolecular dianhydrides thereof, tricarboxylic acids or the monoanhydrides thereof, dicarboxylic acids, and mixtures thereof, in the presence of said catalysts. The polymers are obtained in solution at low reaction temperatures and short reaction times thereby avoiding side-reactions which otherwise would be detrimental to polymer molecular weight and ultimate polymer properties.
REFERENCES:
patent: 3108975 (1963-10-01), Lambert et al.
patent: 3489696 (1970-01-01), Miller
patent: 3562217 (1971-02-01), Zalewski et al.
patent: 3620987 (1971-11-01), McLaughlin
patent: 3658773 (1972-04-01), Zecher et al.
patent: 3682860 (1972-08-01), Yoda et al.
patent: 3701756 (1972-10-01), Carleton et al.
patent: 3803100 (1974-04-01), Izumi et al.
patent: 3853813 (1974-12-01), Edelman et al.
patent: 3873503 (1975-03-01), Hoheisel
patent: 3975345 (1976-08-01), Fessler
Anderson Harold D.
Firth Denis A.
Rose James S.
The Upjohn Company
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