Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Patent
1994-12-09
1995-09-26
Paumen, Gary F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
439886, H01R 402
Patent
active
054530172
ABSTRACT:
An improved connector for an electronic module or the like includes a housing having a socket opening that is sized and configured to accept an electronic module, and a plurality of terminals mounted to the housing. Each of the terminals has a foot portion having a layer of non-solderable material coated on one side of the foot portion to prevent solder from adhering to that side. A capillary nest is formed by a channel surface on the underside of the foot portion when the terminal is mounted on a conductor pad such that solder flows through the capillary nest under the influence of capillary forces from the side of the terminal having a non-solderable coating thereon to the other side for forming a solder joint on that other side. A ring of non-solderable material is coated around a middle portion of the terminal to prevent solder from flowing to the electrical contact surfaces located above the ring. As a result, the connector terminals can be soldered to a printed circuit board or the like in a simple and inexpensive manner and without the formation of known solder defects.
REFERENCES:
patent: 3864004 (1975-02-01), Friend
patent: 4183611 (1980-01-01), Casciotti et al.
patent: 5104324 (1992-04-01), Grabbe et al.
patent: 5199884 (1993-04-01), Kaufman et al.
Berg Technology Inc.
Paumen Gary F.
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