Multiple electronic devices within a single carrier structure

Details Multiple electronic devices within a single carrier structure Multiple electronic devices within a single carrier structure

1990-06-15

1991-07-30

James, Andrew J.

357 72, 357 74, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

050363816

ABSTRACT:
The disclosed invention comprises multiple semiconductor devices within a single carrier structure. In accordance with one embodiment of the invention, a plurality of semiconductor die are coupled to the leads of a leadframe and are encapsulated by individual package bodies. A carrier structure is formed which encircles all of the die and encapsulates portions of the distal ends of the leads. The extreme distal portions of the leads extend through the carrier to form contact points which are used to access the semiconductor die. By having multiple devices within a single carrier, productivity is improved and costs associated with leadframe and carrier structure materials are reduced.

REFERENCES:
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4791472 (1988-12-01), Okikawa et al.
patent: 4801997 (1989-01-01), Ono et al.
patent: 4837184 (1989-06-01), Lin et al.
patent: 4897602 (1990-01-01), Lin et al.
patent: 4951119 (1990-08-01), Yonemochi et al.

Affiliated with

Also associated with

Rating

Multiple electronic devices within a single carrier structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple electronic devices within a single carrier structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple electronic devices within a single carrier structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1545959