Method of assembling a chip carrier

Details Method of assembling a chip carrier Method of assembling a chip carrier

1984-04-12

1986-02-18

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29588, 174 685, 428633, H05K 334

Patent

active

045703370

ABSTRACT:
A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have an indentation formed therein for receiving the chip. A metallic circuit pattern for electrical connection to the chip is bonded to the oxide layer and insulated from the copper or copper base alloy by the refractory oxide layer. A seal is provided for enclosing the chip to the indentation. Another embodiment of the invention includes a circuit board structure comprising a circuit board device having a first coefficient of thermal expansion. A chip carrier is provided having a second coefficient thermal expansion of substantially the same value as the first coefficient of thermal expansion. The chip carrier has electrical leads soldered to the circuit board whereby thermal cycling of the circuit board structure does not substantially stress the bond between the solder, leads and circuit board.

REFERENCES:
patent: 3165672 (1965-01-01), Gellert
patent: 3296099 (1967-01-01), Dinella
patent: 3341369 (1967-09-01), Caule et al.
patent: 3404213 (1968-10-01), Brookover et al.
patent: 3475227 (1969-10-01), Caule et al.
patent: 3495023 (1970-02-01), Hessinger
patent: 3546363 (1970-12-01), Pryor et al.
patent: 3611046 (1971-10-01), Covert
patent: 3618203 (1971-11-01), Pryor
patent: 3676292 (1972-07-01), Pryor et al.
patent: 3676569 (1972-07-01), Thompson
patent: 3676748 (1972-07-01), Kobayashi et al.
patent: 3684818 (1972-08-01), Netherwood
patent: 3698964 (1972-10-01), Caule et al.
patent: 3714370 (1973-01-01), Nixen et al.
patent: 3726987 (1973-04-01), Pryor et al.
patent: 3730779 (1973-05-01), Caule et al.
patent: 3762039 (1973-10-01), Douglass et al.
patent: 3801728 (1974-04-01), Gallo, Jr. et al.
patent: 3810754 (1974-05-01), Ford et al.
patent: 3826627 (1974-07-01), Pryor et al.
patent: 3826629 (1974-07-01), Pryor et al.
patent: 3837895 (1974-09-01), Pryor et al.
patent: 3852148 (1974-12-01), Pryor et al.
patent: 3875478 (1975-01-01), Capstick
patent: 4054938 (1977-10-01), Morris
patent: 4105861 (1978-08-01), Hascoe
patent: 4109054 (1978-08-01), Burgyan
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4172272 (1979-10-01), Schneider
patent: 4294009 (1981-10-01), Quintin et al.
patent: 4330790 (1982-05-01), Burns
patent: 4374457 (1983-02-01), Wiech, Jr.
patent: 4385202 (1983-05-01), Spinelli et al.
patent: 4461924 (1984-07-01), Butt
"Clad Metal Circuit Board Substrates for Direct Mounting of Ceramic Chip Carriers" by Dance and Wallace, First Annual Conference of the International Electronics Packaging Society, Cleveland, Ohio, 1981.
"Use of Metal Core Substrates for Leadless Chip Carrier Interconnection" by Lassen, Electronic Packaging and Production, Mar. 1981, pp. 98-104.
"Chip-Carriers, Pin-Grid Arrays Change the PC-Board Landscape" by Lyman, Electronics, Dec. 29, 1981, pp. 65-75.
"Chip Carriers: Coming Force in Packaging" by Erickson, Electronic Packaging and Production, Mar. 1981, pp. 64-80.

Affiliated with

Also associated with

Rating

Method of assembling a chip carrier does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of assembling a chip carrier, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of assembling a chip carrier will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1543313