1990-05-31
1991-07-30
Lee, John D.
350 9611, 357 74, G02B 642
Patent
active
050354833
ABSTRACT:
A surface-mountable opto-component has at least one transmitter and/or receiver and is capable of being flexibly employed. The surface-mountable opto-component has at least two surfaces and at least two electrical terminals at each of these at least two surfaces so that the opto-component is optionally mountable at each of these two surfaces.
REFERENCES:
patent: 4897711 (1990-01-01), Blonder et al.
patent: 4930857 (1990-06-01), Acarlar
patent: 4945400 (1990-07-01), Blonder et al.
IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978, Lissner et al., "Solderless Connection Method", p. 4090.
"Light Emitting Chip Parts", Tetsuhiro Kiyono, vol. 6, No. 160, (E-126) [1038] Aug. 21, 1982, (Jap. Patent Abstract).
"Chip Carrier", Kiyoshi Ito, vol. 12, No. 498 (E-698) [3345], Dec. 26, 1988, (Jap. Patent Abstract).
Schellhorn Franz
Waitl Guenter
Lee John D.
Siemens Aktiengesellschaft
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