Direct write EC single metal layer

Details Direct write EC single metal layer Direct write EC single metal layer

1992-12-24

1994-03-15

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 361767, 361774, H05K 111

Patent

active

052947548

ABSTRACT:
A direct write and laser delete system for making engineering changes in which top surface metal C4 pads each has a small satellite pad connected to it by a short connecting line that is deleted if an engineering change is to be made. Vias connect the satellite pads to a "personality" wiring layer in the module. A top surface grid of line segments allows any C4 pad to be connected to a point outside the chip boundary by means of one or more short direct write lines. There is one global X and Y engineering change grid on respective X and Y thin-film layers and another global X and Y engineering change grid on respective X and Y multi-layer ceramic module layers. All of these varied patterns are connected to lines with each chip pitch boundary where direct write connections can be made, and a grid line can be interrupted by a laser deletion of a top surface metal line.

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patent: 4840924 (1989-06-01), Kinbara
patent: 5136471 (1992-08-01), Inasaka

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