Hold-down clamp with mult-fingered interchangeable insert for wi

Details Hold-down clamp with mult-fingered interchangeable insert for wi Hold-down clamp with mult-fingered interchangeable insert for wi

1990-07-16

1991-07-30

Chaudhuri, Olik

Metal working

Barrier layer or semiconductor device making

228 45, 228 447, 228179, H01L 2160, H01L 2168

Patent

active

050350340

ABSTRACT:
A multi-fingered clamp assembly provides for the independent clamping of individual leads of a semiconductor device lead frame during wire bonding. The assembly consists of a clamp frame which carries and supports an interchangeable clamp insert. The clamp insert provides individual spring-like fingers which align directly with the leads to be clamped, clamping each lead independently and uniformly. This results in better, more uniform mechanical integrity of the bond. The clamp frame is aligned to the wire bond equipment, allowing a new clamp insert to be inserted for a different application without necessitating realignment.

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