Method and apparatus for scanning exposure having thickness meas

Details Method and apparatus for scanning exposure having thickness meas Method and apparatus for scanning exposure having thickness meas

1997-03-24

1998-04-28

Le, Que

Radiant energy

Photocells; circuits and apparatus

With circuit for evaluating a web, strand, strip, or sheet

2505594, G01N 2186

Patent

active

057448140

ABSTRACT:
A step-and-scan technique for patterning a photoresist film formed on a wafer comprises the steps of storing a relationship between a film thickness and an optimum offset amount of a focal position from the film surface, measuring a first ordinate of the wafer surface at each of the several focusing positions of the wafer, forming a photoresist on the wafer, measuring a second ordinate of the film surface to obtain a film thickness, exposing the photoresist film at each focusing position based on the optimum offset amount of the each focal position which is retrieved based on the film thickness.

REFERENCES:
patent: 5483056 (1996-01-01), Imai

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