Automatic wafer focusing and flattening system

Communications – electrical: acoustic wave systems and devices – Echo systems – Returned signal used for control

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Details

72 11, 73597, G01S 1588

Patent

active

043441602

ABSTRACT:
An automatic focusing system for positioning silicon or other wafer within the focal plane of a photolithographic mask projection system. The position of the wafer is measured at a plurality of points and compared to the position of an optical flat located in the focal plane to provide signals for positioning the wafer at the focal plane of the projection system. The system also includes means for changing the contours of the wafer to cause it to lie in a known plane.

REFERENCES:
patent: 3557773 (1971-05-01), Kubo et al.
patent: 3729966 (1973-05-01), Khoury et al.
patent: 4093378 (1978-06-01), Horr et al.
patent: 4280354 (1981-07-01), Wheeler et al.

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