Nozzles for ink jet devices and method for microfabrication of t

Details Nozzles for ink jet devices and method for microfabrication of t Nozzles for ink jet devices and method for microfabrication of t

1994-05-24

1996-01-30

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating thermal ink jet article

216 2, 347 47, B44C 122

Patent

active

054874831

ABSTRACT:
An ink jet nozzle reduces wetting problems around the ink jetting orifice by providing a hollowed annular, polygonal or n-sided extension lip having sharp angles to prevent ink from settling in the regions surrounding the orifice of the ink jet nozzle. The ink jet nozzle is microfabricated by a two step process including a first step of exposing a (100) silicon wafer having a throughhole and a (100) crystallographic plane or other low index plane to physical sputter erosion, e.g., a plurality of parallel radiating ion beams thus creating a facet that eventually enlarges into a plurality of (111) crystallographic planes or other high index planes. The second step includes an anisotropic chemical etch of the nozzle body using an orientation dependent etching (ODE) technique in which the (100) crystallographic plane is etched at a rate of 35 to 400 times higher than the (111) crystallographic planes. While (100) and (111) crystallographic planes are the preferred embodiments, other pairs of crystallographic planes will also work. The resulting structure includes a (111) oriented lip surrounding the orifice. During the step of anisotropic etching, the (111) crystallographic planes act as a mask to prevent the chemical from etching the (111) plane.

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