Superconductor technology: apparatus – material – process – High temperature – per se – Having tc greater than or equal to 150 k
Patent
1992-10-06
1994-03-08
King, Roy
Superconductor technology: apparatus, material, process
High temperature , per se
Having tc greater than or equal to 150 k
505701, 505702, 505731, 505732, 505730, 427 62, 427314, 4274192, 4274193, 4272557, 257 33, B05D 512, H01L 3924
Patent
active
052927180
ABSTRACT:
Improvement in a process for fabricating a superconducting junction by depositing successively a first oxide superconductor thin layer, a non-superconducting intermediate thin film layer and a second oxide superconductor thin film layer on a substrate in this order.
In the invention, the non-superconducting intermediate thin film layer is composed of MgO and the substrate is preheated at 600.degree.-650.degree. C. for at least 5 minutes in the presence of O.sub.2, and is heated at a temperature between 200.degree. and 400.degree. C. during the non-superconducting intermediate thin film layer is deposited.
REFERENCES:
patent: 5061687 (1991-10-01), Takada et al.
Chang et al, "Microstructure of epitaxial ErBa.sub.2 Cu.sub.3 O.sub.7-x thin films grown on MgO(100) Substrates by rf magnetron sputtering", Appl. Phys. Lett. 54(23) Jun. 1989, pp. 2349-2351.
Eom et al, "Epitaxial and Smooth Films of .alpha.-Axis YBa.sub.2 Cu.sub.3 O.sub.7 ", Science, vol. 249, Sep. 1990 pp. 1549-1552.
IBM Technical Disclosure Bulletin, vol. 32 No. 6A, Nov. 1989 p. 288.
J. J. Kingston et al., "Multilayer YBa.sub.2 Cu.sub.3 O.sub.x -SrTiO.sub.3 -YBa.sub.2 Cu.sub.3 O.sub.x films for insulating crossovers" Applied Physics Letters vol. 56, No. 2, Jan. 8, 1990, New York, US pp. 189-191.
Tidjani M. E. et al., "Heteroepitaxial YBa.sub.2 Cu.sub.3 O.sub.7-x -SrTiO.sub.3 -YBa.sub.2 Cu.sub.3 O.sub.7-x trilayers examined by transmission electron microscopy" Applied Physics Letters vol. 58, No. 18, Feb. 18, 1991, pp. 765-767 New York, US.
"High Tc superconducting oxide sandwich structures and tunnel junctions" IBM Technical Disclosure Bulletin vol. 31, No. 9, Feb. 1989, p. 217, New York, US.
Itozaki Hideo
Matsuura Takashi
Nakanishi Hidenori
Tanaka Saburo
King Roy
Sumitomo Electric Industries Ltd.
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