Method of packaging electronic chip component and method of bond

Details Method of packaging electronic chip component and method of bond Method of packaging electronic chip component and method of bond

1996-08-27

1998-04-28

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438127, 438613, 438614, H01L 2144

Patent

active

057443823

ABSTRACT:
An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the water, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. Such component is packed in a package including a carrier tape having therethrough a space for receiving the component with one end of such space open. A cover is applied to close the open end of the space after the component is inserted therein.

REFERENCES:
patent: 4523372 (1985-06-01), Balda
patent: 4652598 (1987-03-01), Edelman
patent: 4901133 (1990-02-01), Curran et al.
patent: 4907064 (1990-03-01), Yamazaki et al.
patent: 4913930 (1990-04-01), Getson
patent: 4950623 (1990-08-01), Dishon
patent: 4963405 (1990-10-01), Yamashita et al.
patent: 5139610 (1992-08-01), Dunaway et al.
patent: 5244833 (1993-09-01), Gansauge et al.
patent: 5393697 (1995-02-01), Chang et al.
patent: 5436198 (1995-07-01), Shibata
patent: 5496770 (1996-03-01), Park
patent: 5587337 (1996-12-01), Idaka et al.

Affiliated with

Also associated with

Rating

Method of packaging electronic chip component and method of bond does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of packaging electronic chip component and method of bond, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of packaging electronic chip component and method of bond will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1531493