Method and apparatus for forming oblique groove in semiconductor

Details Method and apparatus for forming oblique groove in semiconductor Method and apparatus for forming oblique groove in semiconductor

1982-05-11

1985-05-21

Olszewski, Robert P.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51206R, 51283R, 409132, 409166, B24B 1900, B24D 500

Patent

active

045177694

ABSTRACT:
Method and apparatus for forming a ring-shaped oblique groove in a semiconductor device such as a semiconductor rectifier element for electric power. The method of the present invention is based on the idea of forming the ring-shaped oblique groove with a rotating grinding wheel. The semiconductor device is rotated, and the rotating grinding wheel is made to cut into the rotating semiconductor device to form the groove therein. The grinding wheel is sloped relative to the semiconductor device toward the center of the semiconductor device.

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