Metal working – Method of mechanical manufacture – Electrical device making
Patent
1983-04-14
1985-05-21
Rosenbaum, Mark
Metal working
Method of mechanical manufacture
Electrical device making
29458, 357 80, H05K 334
Patent
active
045177384
ABSTRACT:
A method for hermetically packaging electronic parts such as IC chips within a space defined by a multilayer substrate and a cap is disclosed. A welding rib is formed on the printed circuit board having conductor portions so as to surround those conductor portions over which the electronic parts are to be mounted in a later step. Metal films are formed by nonelectrolytic plating on the conductor portions. A peripheral portion of a cap is placed on the welding rib. A laser beam is radiated onto the contact portion between the peripheral portion and the welding rib so as to weld them together. At this time, a portion of the welding rib which is subject to laser radiation is not covered with the metal film. Welding is thus performed in the absence of phosphorus, which is inevitably contained in the metal film formed by nonelectrolytic plating and is a principal cause of cracking at a welded portion.
REFERENCES:
patent: 2965962 (1960-12-01), Ollendorf et al.
patent: 3191268 (1965-06-01), Matea
patent: 3210171 (1965-10-01), MacDonald
patent: 3211827 (1965-10-01), Trueb et al.
patent: 3217088 (1965-11-01), Steierman
patent: 3485996 (1969-12-01), Chiou et al.
patent: 3872583 (1975-03-01), Beall et al.
Japan Meeting in 1982 of Electro-Communication Institute, 2245, pp. 8-285, "Hybrid IC Type Light Receiving Module" by Tsunoda et al.
IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978, New York, D. Crawford et al., "High Density Multilayer Ceramic Module" pp. 4771-4773.
Fukuoka Yoshitaka
Komine Toshiaki
Arbes Carl J.
Rosenbaum Mark
Tokyo Shibaura Denki Kabushiki Kaisha
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