Resistive laminate for printed circuit boards, method and appara

Details Resistive laminate for printed circuit boards, method and appara Resistive laminate for printed circuit boards, method and appara

1990-04-12

1991-08-13

Powell, William A.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

29620, 118728, 156630, 156643, 156656, 1566591, 1562726, 156902, 20419221, 20429815, 338308, 428901, B32B 300, B44C 122, C23C 1400, C23F 102

Patent

active

050395700

ABSTRACT:
A relatively large dimensioned sputter coated resistive laminate providing uniform laminate dimensions and resistance tolerances over the surface area thereof and a method for making the laminate from a foil, including a platten support step and a sputter etching or cleaning step. The laminate comprises a sputter coated metal foil which is isostatically bonded to an insulative, epoxy resin substrate. In a preferred construction a nickel-chrome-aluminum-silicon resistive layer is applied to a copper foil.

REFERENCES:
patent: 2662957 (1953-12-01), Eisler
patent: 3244581 (1966-04-01), Miller
patent: 3400066 (1968-09-01), Caswell et al.
patent: 4021277 (1977-05-01), Shirn et al.
patent: 4368252 (1983-01-01), Kakuhashi et al.
patent: 4540463 (1985-09-01), Kakuhashi et al.

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