Method for patterning a metal layer

Details Method for patterning a metal layer Method for patterning a metal layer

1992-03-19

1993-04-20

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437194, 437197, 437962, 1566591, 156664, 156665, H01L 21302

Patent

active

052042855

ABSTRACT:
A method for patterning a metal layer without so-called "rabbit ears" comprising the steps of:
deposition of a metal layer on a substrate, deposition of a barrier layer on the metal layer, formation of a mask layer of a predetermined pattern on the barrier layer, etching of the barrier layer and the metal layer under conditions such that the mask layer is also eroded slightly, and removal of the mask layer. In other embodiments, selective etching of barrier layer and mask sidewalls avoids or eliminates such "rabbit ears" and/or etchant product deposits which are precursors of such "rabbit ears".

REFERENCES:
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patent: 4925524 (1990-05-01), Beatty
patent: 4954423 (1990-09-01), McMann et al.
patent: 5017513 (1991-05-01), Takeuchi
patent: 5045150 (1991-09-01), Cleeves et al.
patent: 5134093 (1992-07-01), Onishi et al.
Twenty Five nm Features Patterned With Trilevel E-Beam Resist, D. M. Tennant et al. J. Vacuum Society Technology 19(4), Nov./Dec. 1981, pp. 2-5.
VLSI Engineering, Thomas E. Dillinger, Prentice Hall, pp. 814-817, 1988.
Integrated Circuit Fabrication Technology, David J. Elliott, McGraw-Hill Publishing Co., pp. 98-101, 1989.

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