Chemistry: electrical and wave energy – Processes and products
Patent
1989-05-25
1991-08-13
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
204345, 204 585, 204DIG9, C25D 518, C25D 712
Patent
active
050393812
ABSTRACT:
A method for electroplating a layer of a precious metal, copper or aluminum on a surface of a semiconductor device, an integrated circuit, or the like employs an electrolytic cell in which the cathode comprises a semiconductor device, an integrated circuit device, or the like, having a surface for receiving the precious metal layer. The surface is oriented in a position normal to a vector representing the acceleration of gravity and facing the anode of the cell. An electroplating direct current on the order of about 0.1 milliamp/cm.sup.2 is employed while superimposing a time varying electromagnetic field in the range of about 1 to about 100 megahertz on the direct current. The electroplating current and the electromagnetic field are employed in the absence of convection, i.e. stirring, in the electrolyte. The product produced by the described method comprises a smooth, evenly distributed layer of the precious metal having a microstructure that is characteristic of single crystals.
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Leader William T.
Niebling John F.
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