Mold for use in resin encapsulation molding

Details Mold for use in resin encapsulation molding Mold for use in resin encapsulation molding

1992-01-23

1993-04-20

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

249110, 249 95, 264272170, 425544, 425588, 425DIG228, B29C 4502, B29C 4518

Patent

active

052041220

ABSTRACT:
A mold system for use in resin encapsulation molding includes a cavity serving as a resin molding section in which small size electric elements such as semiconductor devices and electrical parts are encapsulated with a synthetic resin. The system also incudes at least one pot for receiving the synthetic resin material and melting the received synthetic resin material by heating, a cull section communicating with the pot and formed facing to an opening end face, and a conveying passage for communicating the cull section and the cavity to convey molten resin material through the cull section. The synthetic resin material is placed in the cavity and is heated to melt therein, and is extruded out of the pot by a plunger disposed in an axial direction of the pot. The inner bottom of the cull section facing to the opening end face of the pot is formed unevenly.

REFERENCES:
patent: 2476558 (1949-07-01), Moxness
patent: 3764248 (1973-10-01), Hall
patent: 4900485 (1990-02-01), Murakami

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