Cooler for removing heat from a heated region

Details Cooler for removing heat from a heated region Cooler for removing heat from a heated region

1996-10-02

1998-11-10

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 174 151, 257714, H05K 720

Patent

active

058353453

ABSTRACT:
A cooler features a plurality of microchannels each of which includes a plurality of baffles disposed therein to avoid laminar flow within each microchannel through modulation which varies both the direction and velocity of fluid flowing through each microchannel. The microchannels are formed between a plurality of spaced apart thermally conductive fins, which are arranged to extend from a thermally conductive substrate adapted to be in physical contact with a region to be cooled. The fins are formed by stacking a plurality of thin sheets along a direction transverse to a longitudinal axis of the microchannels. Each sheet includes a plurality of apertures spaced apart along two transverse directions, both of which are transverse to the stacking direction. The baffles are formed from the spaces disposed between the apertures. Preferably, each sheet is formed from copper which is chemically etched to form the apertures in the sheet.

REFERENCES:
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patent: 4758926 (1988-07-01), Herrell et al.
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patent: 5016090 (1991-05-01), Galyon et al.
patent: 5103374 (1992-04-01), Azar
patent: 5105430 (1992-04-01), Mundinger et al.
patent: 5388635 (1995-02-01), Gruber et al.
patent: 5526231 (1996-06-01), Arz et al.

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