Method for fabricating a focal plane array for thermal imaging s

Details Method for fabricating a focal plane array for thermal imaging s Method for fabricating a focal plane array for thermal imaging s

1995-06-07

1998-04-28

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29 2535, 29832, 29847, 22818022, 250332, 2503382, 2503384, 348165, 427100, 430349, H01L 310264, H05K 310, H05K 334

Patent

active

057430063

ABSTRACT:
A hybrid thermal imaging system (20, 120) often includes a focal plane array (30, 130), a thermal isolation structure (50, 150) and an integrated circuit substrate (60, 160). The focal plane array (30, 130) includes thermal sensitive elements (42, 142) formed from a pyroelectric film layer (82), such as barium strontium titanate (BST). One side of the thermal sensitive elements (42, 142) may be coupled to a contact pad (62, 162) disposed on the integrated circuit substrate (60, 160) through a mesa strip conductor (56, 150) of the thermal isolation structure (50, 150). The other side of the thermal sensitive elements (42, 142) may be coupled to an electrode (36, 136). The various components of the focal plane array (30, 130) may be fabricated from multiple heterogeneous layers (74, 34, 36, 82, 84) formed on a carrier substrate (70).

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