Planarization method

Details Planarization method Planarization method

1986-09-11

1989-02-21

Bell, Janyce

Fishing, trapping, and vermin destroying

437231, 427240, 427401, B05D 512, B05D 212

Patent

active

048065048

ABSTRACT:
A liquid polymeric resin is applied over an irregular surface of a semiconductor substrate by first spinning followed by rotation of the substrate about an axis parallel to and spaced-apart from the plane of the substrate. Such a technique provides for planarization layer having enhanced planarity. When applied over an underlying insulating layer, the planarization layer will typically be etched back in order to planarize the insulating layer. Alternatively, the planarization layer may be formed directly over the semiconductor substrate, and an insulating layer formed over the planarization layer. In either case, the substrates are then ready for subsequent processing according to well known techniques, typically the formation of metallization layers over the insulating layer.

REFERENCES:
patent: 3730760 (1973-05-01), Machmiller
patent: 4271209 (1981-06-01), DePalma et al.
patent: 4515828 (1985-05-01), Economy et al.

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